About 3EAI 2026

About 3EAI 2026

2026 International Conference on Electrical and Electronics Engineering and Artificial Intelligence (3EAI 2026) will be held grandly in Tumxuk,Xinjiang, China on November 6-8, 2026.

The 2026 International Conference on Electrical and Electronics Engineering and Artificial Intelligence (3EAI 2026) aims to bring together global experts, scholars, and researchers to discuss the latest advancements and technical applications in the fields of Electrical Engineering, Electronics, and Artificial Intelligence. Focusing on cutting-edge theories and core technologies, the conference provides a high-level academic exchange platform to foster interdisciplinary collaboration and innovative development. We warmly welcome scholars from around the world to submit papers and participate in this academic event.

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Important Dates

Important Dates

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Full Paper Submission Date

August 1, 2026


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Registration Deadline

September 15, 2026


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Final Paper Submission Date

September 30, 2026


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Conference Dates

November 6-8, 2026


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Conference Topics

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Electrical Engineering

Power Systems and Automation; Smart Grid and Microgrid Technologies; High Voltage and Insulation Technology; Power Electronics and Drive Control; Electrical Machines and Devices Optimization; Power Quality and Electromagnetic Compatibility; Renewable Energy Generation and Grid Integration; Battery Management Systems and Energy Storage

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Electronic Engineering

Circuits and Systems Design; Very Large Scale Integration (VLSI); Embedded Systems and Internet of Things; Communications and Wireless Networks; Signal and Image Processing; Microwave Technology and Antenna Design; Optoelectronics and Laser Technology; Semiconductor Devices and Sensor Technology

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Artificial Intelligence 

Machine Learning and Deep Learning; Computer Vision and Pattern Recognition; Natural Language Processing and Understanding; Intelligent Control and Robotics; Data Mining and Knowledge Discovery; Fuzzy Systems and Evolutionary Algorithms; Multi-Agent Systems; Explainable AI and Large Language Models

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Interdisciplinary and Emerging Topics

AI Applications in Electrical and Electronic Systems; Industry 4.0 and Intelligent Manufacturing; Digital Twins and Cyber-Physical Systems (CPS); Intelligent Fault Diagnosis and Predictive Maintenance; Autonomous Driving and Intelligent Transportation; Edge AI and Embedded Intelligent Systems

Publication

Publication

IEEE

All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the IEEE Conference Proceedings, and submitted to IEEE Xpolre, EI Compendex, Scopus for indexing.

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Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

Sponsored by

Sponsored by

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Supporter

Supported by

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Technical Supported by

IEEE, IEEE Systems, Man, and Cybernetics Society, IEEE SMC Wuhan Section

contact
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Contact

Conference Secretary: Ms.Liu

Tel: +86-18024032582 (Wechat)

E-Mail: ic3eai@163.com

QQ:2489647082

If you have any questions or inquiries, please feel free to contact us.

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